CoBRA: Low cost compensation of TSV failures in 3D-NoC

Ronak Salamat; Masoumeh Ebrahimi; Nader  Bagherzadeh; F. Verbeek

doi:10.1109/DFT.2016.7684081

CoBRA: Low cost compensation of TSV failures in 3D-NoC

Ronak Salamat, Masoumeh Ebrahimi, Nader Bagherzadeh, F. Verbeek

Research Line Resilience (part of LIRS program)

Research output: Chapter in Book/Report/Conference proceeding › Conference Article in proceeding › Academic › peer-review

Original language	English
Title of host publication	2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)
Subtitle of host publication	September 19-20, 2016
Place of Publication	Danvers, MA
Publisher	IEEE
Pages	115-120
Number of pages	6
ISBN (Electronic)	9781509036233
ISBN (Print)	9781509036240
DOIs	https://doi.org/10.1109/DFT.2016.7684081
Publication status	Published - 2016
Event	2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems - University of Connecticut, Storrs, United States Duration: 19 Sept 2016 → 20 Sept 2016

Symposium

Symposium	2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
Abbreviated title	DFT 2016
Country/Territory	United States
City	Storrs
Period	19/09/16 → 20/09/16

Access to Document

10.1109/DFT.2016.7684081

Cite this

@inproceedings{526ad454b33c472182dc352ff0ab4e77,

title = "CoBRA: Low cost compensation of TSV failures in 3D-NoC",

author = "Ronak Salamat and Masoumeh Ebrahimi and Nader Bagherzadeh and F. Verbeek",

year = "2016",

doi = "10.1109/DFT.2016.7684081",

language = "English",

isbn = "9781509036240",

pages = "115--120",

booktitle = "2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)",

publisher = "IEEE",

address = "United States",

note = "2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and<br/>Nanotechnology Systems, DFT 2016 ; Conference date: 19-09-2016 Through 20-09-2016",

}

Salamat, R, Ebrahimi, M, Bagherzadeh, N & Verbeek, F 2016, CoBRA: Low cost compensation of TSV failures in 3D-NoC. in 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT): September 19-20, 2016 . IEEE, Danvers, MA, pp. 115-120, 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and
Nanotechnology Systems, Storrs, Connecticut, United States, 19/09/16. https://doi.org/10.1109/DFT.2016.7684081

CoBRA: Low cost compensation of TSV failures in 3D-NoC. / Salamat, Ronak; Ebrahimi, Masoumeh; Bagherzadeh, Nader et al.
2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT): September 19-20, 2016 . Danvers, MA: IEEE, 2016. p. 115-120.

Research output: Chapter in Book/Report/Conference proceeding › Conference Article in proceeding › Academic › peer-review

TY - GEN

T1 - CoBRA: Low cost compensation of TSV failures in 3D-NoC

AU - Salamat, Ronak

AU - Ebrahimi, Masoumeh

AU - Bagherzadeh, Nader

AU - Verbeek, F.

PY - 2016

Y1 - 2016

U2 - 10.1109/DFT.2016.7684081

DO - 10.1109/DFT.2016.7684081

M3 - Conference Article in proceeding

SN - 9781509036240

SP - 115

EP - 120

BT - 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)

PB - IEEE

CY - Danvers, MA

T2 - 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and<br/>Nanotechnology Systems

Y2 - 19 September 2016 through 20 September 2016

ER -